PART |
Description |
Maker |
664-A-5002B 668-A-1001F |
Isolated and bussed circuits Isolated and bussed circuits Thin film resistor network 0.150?/a> SOIC packages RoHS compliant available
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List of Unclassifed Manufac...
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IXGR40N60B |
HiPerFASTTM IGBT (Electrically Isolated Backside)
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IXYS Corporation
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IXGR16N170AH1 |
High Voltage IGBT with Diode Electrically Isolated Tab
|
IXYS Corporation
|
IXSR35N120BD1 |
IGBT with Diode ISOPLUS 247 (Electrically Isolated Backside)
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IXYS Corporation
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IXGR60N60C2 IXGR60N60C2D1 |
Lightspeed 2TM Series (Electrically Isolated Back Surface) 75 A, 600 V, N-CHANNEL IGBT
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IXYS, Corp. IXYS[IXYS Corporation]
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LSN-1.1_10-D12 LSN-3.8_10-D12 LSN-1.2_10-D12 LSN-1 |
Single Output, Non-Isolated, 12VIN, 1-5VOUT, 10A, DC/DCs in SIP Packages
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Murata Manufacturing Co., Ltd.
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DSEP30-12CR L373 |
HiPerDynFRED with soft recovery (Electrically Isolated Back Surface) 30 A, 1200 V, SILICON, RECTIFIER DIODE Fast Recovery Diodes
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IXYS, Corp. IXYS[IXYS Corporation] ETC
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ISPLSI2128A-100LQ160 ISPLSI2128A-80LT176 ISPLSI212 |
Electrically-Erasable Complex PLD Electrically-ErasableComplexPLD
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MBR2X050A080 |
Electrically Isolated Base Plate
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GeneSiC Semiconductor, ...
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IXFR180N085 |
Discrete MOSFETs: HiPerFET Power MOSFETS HiPerFET-TM Power MOSFETs ISOPLUS247-TM (Electrically Isolated Back Surface)
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IXYS Corporation
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DG3409DB DG3015DB DG3408DB |
Device Orientation-MICRO FOOT Packages Device OrientationMICRO FOOT Packages Device OrientationMICRO FOOT Packages
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VISAY[Vishay Siliconix] Vishay Intertechnology,Inc.
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